Wednesday 18 September 2019 (All day) to Thursday 19 September 2019 (All day)
Technology and Innovation Centre, Strathclyde University, Glasgow, Scotland

HISTELCON is an IEEE Region 8 conference covering topics in the area of Technology History. The first HISTELCON was, in Paris, France (2008) with the theme “History of Telecommunications”. It was organised by the IEEE France Section and SEE (Société de l'Electricité, de l'Electronique et des Technologies de l'Information et de la Communication ). Subsequent HISTELCONs were in Madrid, Spain (2010), Pavia, Italy (2012), Tel-Aviv, Israel (2015), and Kobe, Japan (2017)

The primary theme is ‘historic computers’ with an aim to include papers on those inventions and developments which have not already been the subject of extensive historical publications, and to include the contribution special purpose processors have made to the development and use of advanced digital signal processing methods in many applications areas. Sessions to cover other aspects of technology history in the electrical, electronic and related fields will also be provided for.

In accordance with the traditions of previous HISTELCONs, the conference will include invited keynote lectures as well as submitted, reviewed contributions. Authors of papers presented at the conference may be invited to submit an extended or revised version for further review and consideration for submission to IEEE Xplore.

Among the computer topics which might be included are, for examples, the history of the F100L and the Viper microprocessor, the Mascot real-time software design method, the Transputer, the ARM computer designs, and the impact of digital signal processing microprocessors including the TMS 320 for the implementation of very sophisticated signal processing algorithms.

The aim is to keep the conference affordable, with reduced registration fees for IEEE members and members of co-sponsoring organisations, and low fees for IEEE student members

The call for papers is expected soon, with an estimated submission deadline around the end of February 2019